NEW STEP BY STEP MAP FOR NOOHAPOU

New Step by Step Map For Noohapou

New Step by Step Map For Noohapou

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The POU3500 procedure offers dynamic temperature Charge of the method chamber cathode / electrode / anode and will be synchronized with any etch procedure.

Resource & TCU program calibration strategies vary exterior examination products not utilised routinely for verifying

The information under is classified by semiconductor approach and Instrument manufacturer. Each individual table involves an Applications Matrix that displays qulified and professional processes.

initially Established in 1985, our company has grown right into a regarded leader in giving temperature Regulate techniques to the worldwide semiconductor marketplace.

This amazing method, offering a little kind issue, affordable-of-Ownership and Dynamic Temperature Regulate provided system and gear engineers a whole new Device to improve their temperature delicate processes.

we're guided inside our perception that prosperity Within this aggressive market stems from offering clients with very engineered new goods and world class customer service.

The precision from the POU 3500 allows for unbiased control of the method fluid temperature into the wafer chuck within just +/- 0.1 °C of established issue, along with the speedy response time in the system makes it possible for for maximum wafer-to-wafer repeatability all over the etch approach.

Along with the POU3300, it is possible to accomplish unparalleled leads to etch efficiency, chamber uptime, lowered price of ownership and fab Area utilization – all while strengthening your method dependability.

the info pertains to your 300mm chamber temperature profile throughout a higher component ratio Etch course of action, working at quite higher RF ability conditions (~three.8kW). The powerful components of this information set are:

Dynamic Temperature Management, as applied in devices like the LAUDA-Noah POU, can be an method that senses the temperature of the process fluid returning from the procedure chamber’s wafer chuck (ESC) and dynamically adjusts the temperature on the supplied method fluid dependant on this real-time comments.

The data established here is from the 200mm quantity output wafer fab and clearly illustrates the advantage of the LAUDA-Noah POU procedure.

a lot more than ever, shrinking system geometries, demanding new procedures along with a highly aggressive ecosystem call for temperature Handle units that Blend quick and exact temperature Manage using an emphasis on lowered operating charges and enhanced reliability.

the truth is the fact genuine Dynamic Temperature Command can only be accomplished when all five (5) of the subsequent program style and set up specifications are achieved:

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We have to have significantly less cooling/heating capability for a similar software as being a get more info static TCU on account of our compact reservoir quantity.

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